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Telecom
3D-Printed PCBs & RF Structures for Telecom
The challenge
Why Telecom R&D Needs a New Approach to PCB & RF Manufacturing
RF Evolution
Telecom hardware is evolving toward higher frequencies, tighter integration.
Fragmented Supply
Traditional PCB manufacturing for RF/microwave systems involves multiple vendors, long lead times, and material constraints.
Split Processes
Antennas, waveguides, and shielding still require separate manufacturing and assembly processes.
Lprint’s solution
One Platform — PCBs, Antennas, and RF Elements Printed Together
Integrated functional printing
PCBs, antennas, shielding, and 3D structures in a single manufacturing step.
RF-optimized materials
from high-temp thermoplastics to advanced ceramic-like dielectrics for low-loss, high-frequency performance.
True design freedom
arbitrary via geometries, non-planar boards, volumetric routing, and mixed layer counts.
Rapid iteration
from CAD to finished board in hours, directly on-site.
No toxic waste
additive process, no acid etching, zero water consumption.
