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The complete solution for aditive multilayer PCB printing

Our laser-driven, nozzle-free printer, industrial-grade materials, and unified software let you load a Gerber file and print fully finished multilayer boards — any geometry, any layer count, right on your bench.
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How it works?

Keep the workflow you already know: design, export, done. With Lprint, that familiar file goes straight to a laser-driven 3D printer that delivers a fully functional, multilayer PCB within the same workday.
Ecad Design
Create PCB layout in Altium, KiCAD, Cadence, etc...
Import
Load design files into Lprint’s local software
Print each layer
  • Material deposition (conductive or insulating) from cartridges
  • Laser sintering bonds layers together
3D modeling, slicing
Software converts files into a 3D PCB model, slices into layers
Get final PCB
Builds up all layers — conductors, vias, insulation — from scratch.
Assemble
Final PCBs drop into your existing soldering or EMS lines

Fewer Resources, More Innovation

Traditional electronics rely on acid baths, copper‑laminated substrates, and global supply chains. Lprint flips the model: local on‑demand printing, zero chemical etching, and energy efficiency.
-85%
carbon footprint
-90%
raw‑material
consumption
-95%
water consumption
-50%
energy consumption

Significantly reduces processes,materials and equipment

01.
Any-layer Connectivity
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected
02.
Free-Form Vias & Routing
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected
03.
3D Internal Routing
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected
04.
Mixed Layer Count & Variable Stack-Up
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected
05.
Uniformity of the conductive layer thickness
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected
06.
Thick & Complex Internal Pathways
  • Enables any combination of layer connections, without drilling, plating, back-drilling etc
  • No restrictions on which layers can be connected

Learn more
about Lprint

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